BRUSSELS (Reuters) – The European Commission has approved a 1.3 billion euro ($1.36 billion) Italian state aid measure to support Singapore-based semiconductor firm Silicon Box in setting up a new semiconductor advanced packaging facility in Italy’s Piedmont region, it said in a statement on Wednesday.
It said the facility would be the “first-of-a-kind in Europe, as there is currently no comparable advanced
packaging facility.”
Under the EU Chips Act, public money is provided largely by national governments while the vetting of projects takes place in Brussels.
($1 = 0.9532 euros)
(Reporting by Charlotte Van Campenhout, Editing by Tomasz Janowski)
