Exclusive-China readying $143 billion package for its chip firms in face of U.S. curbs -sources
By Julie Zhu HONG KONG (Reuters) -China is working on a more than 1 trillion yuan ($143 billion) support package for its semiconductor industry, three sources said, in a major step towards self sufficiency in chips and to counter U.S. moves aimed at slowing its technological advances. Beijing plans to roll out what will be …









